Founded in 1976, Samtec is a privately held, $950 million global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 40+ international locations and products sold in more than 125 different countries, Samtec’s global presence enables its unmatched customer service.    

Samtec began investing in Microelectronics in 2010 and has emerged as a technology leader in advanced glass-based packaging. As we expand our investment in this cutting-edge technology, we are looking for energetic and innovative experts to join our growing team of scientists and engineers developing glass interposers and other novel device fabrication technologies for transparent substrates.  One critical role is for a world-class wafer development engineering director to join the Glass Core Technology Development Center and Wafer Fab in New Albany, Indiana. The successful candidate will be responsible for developing wafer fabrication process, integration flows, and metrology tools for enabling novel devices to be fabricated.  They will work with the engineering, manufacturing, sales and marketing teams to ensure that products being developed for our GCT customers (both internal and external to Samtec) meet performance, design, and price requirements, and they can be further fabricated and integrated into the customers’ final products.   

 **THIS POSITION WILL BE ONSITE IN NEW ALBANY, IN ** 

• Education: Advanced degree in Electrical Engineering, Materials Science, Physics, or related field. PhD preferred.
• Experience: Extensive experience (10+ years) in semiconductor or microelectronics industry with a focus on wafer development, process engineering, and technology transfer. Experience in glass-based packaging or advanced semiconductor packaging technologies is highly desirable.
• Leadership: Proven track record that includes 5+ years of leading high-performance teams in a technology-driven environment.
• Innovation Mindset: Passion for innovation and disruptive technologies, with a deep understanding of materials science and semiconductor manufacturing processes.
• Communication Skills: Strong interpersonal and communication skills, with the ability to articulate complex technical concepts to diverse stakeholders.

Technical Skills

• Expertise with Glass, Silicon, Semiconductor, Silicon Photonics, or Hard drive wafer process development and integration, qualification and high-volume manufacturing are strongly desired.
• Solid Experience with fab equipment including lithography (i-line), PVD, CVD, wet etch, dry etch (RIE), ECD Cu plating, final finish plating, electrical test, and characterization is strongly desired. 
• Candidate experience must demonstrate success at developing process flows which integrate process modules (lithography, deposition, etch) to deliver new products for customers on time. 

About Samtec

Founded in 1976, Samtec is a privately held, $950 million global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 40+ international locations and products sold in more than 125 different countries, Samtec’s global presence enables its unmatched customer service.

Connections working at Samtec